2020 is the final year of the national 13th Five Year Plan. During the 13th Five Year Plan period, as an important growth point in the sensor field, the MEMSindustry has achieved particularly fruitful results, and China has become the fastest-growing region in theglobal MEMS market.
The application of consumer electronics and automotive electronics has made significant progress, and industries such as 5G and the Internet of Things are thriving, driving the rapid growth of MEMS products,The market size of China's MEMS industry has grown from 36.3 billion yuan in 2016, with an average annual compound growth rate of 15%, to about 70.8 billion yuan in 2020, far exceeding the global growth rate of about 9.6%。The MEMS industry has formed a number of industrial clusters in Chinese Mainland. Suzhou, Beijing, Shanghai, Shenzhen, Wuhan, Zhengzhou, Wuxi and other places are vigorously developing the MEMS industry. Many provinces and cities have issued supporting policies for MEMS and sensor industries and established industrial parks.
However, it should also be noted that China's MEMS industry is currently in a relatively weak positionThe vast majority of enterprises are small and medium-sized enterprises, lacking leading companies like ST and BOSCH. There is still a significant gap in technological level and accumulation compared to foreign countries, and the market is mainly occupied by foreign brands, especially high-end products. In the current complex international environment, how to better develop China's MEMS industry is a common issue facing all MEMS colleagues.
In the future, the development of China's MEMS industry will present the following characteristics:
Firstly, the next decade will be the golden decade for China's MEMS industry. China US trade frictions, technology decoupling, and the long-term impact of the US crackdown on certain enterprises, including the COVID-19, are the difficulties we have to face, and they have also brought significant negative impacts on our industrial development, especially at the market end. However, external pressures have also brought us opportunities. One is the opportunity for localization, as companies that were previously unwilling or afraid to use domestic chips have had to use them; The second is the opportunity of the Science and Technology Innovation Board. The era of technological wealth creation has arrived, and the listing of some MEMS companies has brought good demonstration effects; Thirdly, there are new infrastructure opportunities and new demands brought by the 5G and IoT markets; The fourth is the opportunity for national support, as the country is increasing policy and financial investment to support the MEMS industry. Therefore, it can be predicted that the next decade will be the golden decade for China's MEMS industry.
Secondly, the innovation capability of Chinese MEMS enterprises urgently needs to be improved. The MEMS industry has a bright future, but there is still a significant gap in the independent innovation capabilities of Chinese MEMS companies compared to foreign companies. There is more imitation and less originality
Innovation requires talent. MEMS is different from IC. To make good MEMS products, it requires composite talents who understand both microelectronics and various disciplines such as force, sound, light, electricity, magnetism, and heat. How to cultivate talents is not only necessary for MEMS practitioners, but also for the entire social education system to strengthen.
Thirdly, OEM manufacturing is an important characteristic of China's MEMS industry. The traditional view is that MEMS is a product and a process that is not suitable for the OEM model. However, based on our experience in operating 6-inch foundries, MEMS technology is gradually becoming standardized and compatible, and MEMS and IC are much smaller in size. The IDM mode requires huge investment and high operational difficulty, which demands high comprehensive strength from the company. Most MEMS companies are actually more suitable for the OEM mode. And we have found that through some innovative mechanisms, design companies can break free from the constraints of heavy asset investment while enjoying the advantages of short development cycle and good quality control of IDM mode.
The current international situation is becoming increasingly complex, and enterprises generally have a need to avoid risks. At the same time, the domestic MEMS manufacturing level continues to improve, with obvious advantages such as fast response, low communication costs, and price. Therefore, many enterprises are actively considering returning the manufacturing process to mainland China, and this trend is very obvious. This has also accelerated the construction of MEMS wafer fabs in mainland China, further strengthening our country's MEMS manufacturing capabilities. The local government has played a positive role in promoting this, but we also suggest adapting measures to local conditions, scientifically demonstrating, and comprehensively considering the local industrial chain, talent, and other situations to avoid rushing forward, resulting in redundant construction, difficulties in later operation, and other phenomena.
Fourthly, advanced packaging is an important link in the MEMS industry.MEMS packaging is an important factor in determining the performance of MEMS devices, requiring the simultaneous implementation of multiple functions such as chip protection and external signal interaction. The quality of packaging technology largely determines the performance and cost of MEMS products. Compared with IC packaging, MEMS packaging needs to consider more factors, is more complex, and has different standards, often requiring customization. In recent years, 3D wafer level packaging technology has made significant progress, integrating MEMS and ASIC together to further improve efficiency and reduce size, which is an important direction in the field of advanced MEMS packaging.
Fifth, new materials and sensor integration are new opportunities for the MEMS industry. Silicon based MEMS has been developed for over 40 years, and how to significantly improve product performance and reduce costs is a huge opportunity for MEMS devices based on new materials. For example, new materials such as PZT, aluminum nitride, vanadium oxide and other MEMS devices are making breakthroughs, and the next step is expected to be rapid application, replacing some traditional silicon-based products. At the same time, combining multiple single function sensors into a multifunctional sensor module, and then using sensor integration technology that integrates microcontrollers, microprocessors, and other chips, is also a new market opportunity for the MEMS industry.
The GINS100 GNSS/INS integrated navigation series product is a high-performance micro inertial device and high-performance satellite receiver module integrated navigation product launched by Wuxi Huilian Information Technology Co., Ltd. This series of products consists of Micro Inertial Measurement Unit (MIMU), satellite receiving module, data acquisition and navigation solution board, power module, etc. Through integrated reinforcement design, the products meet the requirements of high reliability and high dynamic adaptability. The Micro Inertial Measurement Unit (MIMU) consists of three silicon micro MEMS gyroscopes, three MEMS accelerometers, and a temperature sensor, which can measure angular velocity, acceleration, and temperature to meet the measurement and calculation requirements of the product's inertial unit. The satellite receiving module can simultaneously receive signals from Beidou, GPS, and GLONASS navigation satellites, providing high reliability, high-precision three-dimensional attitude, position, velocity, and time information.
By adopting an optimized combination filtering algorithm that combines the advantages of both inertial navigation and satellite navigation, the system can provide continuous and reliable output of navigation information such as attitude, velocity, position, and time, as well as raw data (three-axis angular velocity, three-axis acceleration) information from the inertial measurement unit.
